Faculty Mobility for Partnership Building Program – Funding Available
Posted on: Oct 19, 2021Dear Faculty Members,
Please see the notice below regarding grants available through the Faculty Mobility for Partnership Building Program.
If you are interested in applying for a grant through this program, please contact Amanda Thorson, Manager, International Relations (Amanda.thorson@concordia.ab.ca). Amanda can assist in facilitating a connection with one of CUE’s partner institutions in Latin America and the Caribbean and can provide access to CUE’s Application for International Funds Approval Form that is now required when applying for international funding.
The Office of Financial Aid and Awards will provide further assistance through the application process for those who would like to apply.
Grants available for faculty at Canadian postsecondary institutions
Funding for the Faculty Mobility for Partnership Building Program is made available by Global Affairs Canada through its legal title: the Department of Foreign Affairs, Trade and Development (DFATD).
The Faculty Mobility for Partnership Building Program aims to support Canadian postsecondary institutions that are developing new collaboration and short-term exchange agreements or strengthening existing agreements with Emerging Leaders in the Americas Program (ELAP)-eligible institutions in Latin America and the Caribbean. Canadian postsecondary institutions apply on behalf of faculty by filling out an online application form detailing the proposed study or research projects in eligible countries.
- Program name: Faculty Mobility for Partnership Building Program
- Funding organization: Government of Canada
- Target audience: Canadian postsecondary institutions
- Duration: Three to eight weeks
- Value: Up to CAD 7,000 per project
- Inclusions: Airfare, living expenses, health insurance and visa or work permit fees and other eligible expenses
- Deadline: December 2, 2021
For full program and application details, visit Faculty Mobility for Partnership Building Program.